Researchers at the University of California, Santa Barbara have developed a selective spin-coating deposition technique that requires no post-processing or subsequent steps to generate thin film patterns on heterogeneous substrates. First, a SAM is selectively deposited over just one of the substrate materials. Consequently, when the substrate is exposed to a polymer solution and spun, the solution dewets from the SAM and a polymer coating is formed only over the non-SAM functionalized regions. This technique, which is capable of templating thinner subsequent layers at a faster rate and with fewer resources, enables more precise control over the spatial distribution of polymeric thin film and can be used for microelectronics tasks such as protecting copper while biasing growth only on silicon dioxide.
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Advantages
- The fast, cheap, and scalable fabrication process for heterogeneous surfaces
- No post-processing is required after spin coating
- Compatible with existing chemical and topographic templates
- Does not require perfect self-assembled monolayers
Potential Applications
- Photolithography
- Microelectronics
Contact Information
Name: Mary Raven
Email: raven@tia.ucsb.edu