Defect Characterization for Semiconductors, including Perovskites, in Operando or during Manufacturing, using ‘Peel and Stick’ Probe with Enhanced Sensitivity

A “stick and peel” removable electrochemical probe is used for solvent-free characterization of semiconductor films or optoelectronic devices.  The invention may be used to analyze electronic materials such as a metal halide perovskite…

A “stick and peel” removable electrochemical probe is used for solvent-free characterization of semiconductor films or optoelectronic devices.  The invention may be used to analyze electronic materials such as a metal halide perovskite, an organic semiconductor, a nanocrystalline (quantum dot) thin film, metal oxides, a material blend, or a device stack.  The method may be used to analyze numerous characteristics, such as numbers of defects or defect density, stability, surface composition, bandgap, physical structure, electroactivity, band bending, migration/diffusion process, and charging effects.    This probe technology can be used in the manufacturing or analysis of thin-film stacks to improve their performance and robustness.   

Background:
As an example, perovskite solar cells represent an emerging category of thin-film solar cells with very good prospects for becoming a replacement for not only other thin-film solar technologies but also as a substitute for crystalline silicon. Their efficiency has grown rapidly in a short time, leading to the conclusion that very high efficiencies can be achieved, higher than what is theoretically possible for other types of solar cells. The issue that these cells face is a short life span as they decrease in efficiency quickly compared to more traditional methods of harvesting solar energy. This tech has the ability to bring more understanding of the defect formation in perovskite films manufacturing, ultimately improving the stability and life span of thin-film perovskite solar cells.

Applications:
•    Semiconductor films and optoelectronics, including perovskite solar cells
•    Film, material, material blend, or device stack
•    Manufacturing, QC control
•    Field QC, maintenance, troubleshooting

Advantages:
•    Simple "Stick and Peel" or incorporate in device
•    Enables manufacturing and field quality control
•    Improve and speed the development of long-term stability of optoelectronic devices
•    Numerous material characteristics may be measured under operando conditions
•    Cost-efficient

Website: 

https://arizona.technologypublisher.com/tech?title=Defect_Characterization_for_Semiconductors%2c_including_Perovskites%2c_in_Operando_or_during_Manufacturing%2c_using_%27Peel_and_Stick%27_Probe_with_Enhanced_Sensitivity

Contact Information:

TTO Home Page: https://arizona.technologypublisher.com

Name: Laura Silva

Title: Sr. Licensing Manager, COS

Department: TLA

Email: lauras@tla.arizona.edu